The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
May. 08, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventor:
Young Hoon Kwark, Yorktown Heights, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/49 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H05K 1/18 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/481 (2013.01); H01L 21/4882 (2013.01); H01L 23/13 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/165 (2013.01); H05K 1/183 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40237 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49433 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19031 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/092 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/049 (2013.01);
Abstract
An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.