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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10818566 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Jun. 27, 2019

Circuit module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Ken Okada, Kyoto, JP;

Kazushige Sato, Kyoto, JP;

Shingo Funakawa, Kyoto, JP;

Katsuhiko Fujikawa, Kyoto, JP;

Nobumitsu Amachi, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Sheikh Maruf

Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H03H 9/25 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/49537 (2013.01); H01L 23/5389 (2013.01); H01L 25/105 (2013.01); H03H 9/25 (2013.01); H05K 1/0204 (2013.01); H05K 1/0209 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10621 (2013.01);
Abstract

A circuit module () includes a substrate () having a principal surface (), a first component () mounted on the principal surface (), and a sealing resin portion () that covers at least a side surface of the first component () while covering the principal surface (). The first component () includes an empty portion () and a connection portion () exposed to the empty portion (). The sealing resin portion () is arranged to avoid at least a part of a region that is included in an upper surface of the first component () and corresponds to the empty portion ().

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