The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jan. 15, 2019
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Abner Bello, Clifton Park, NY (US);

Stephanie Waite, Glens Falls, NY (US);

William J. Fosnight, Saratoga Springs, NY (US);

Thomas Beeg, Gansevoort, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/00 (2006.01); H01L 21/673 (2006.01); H01L 21/66 (2006.01); G01N 21/55 (2014.01); G01N 21/21 (2006.01); G01J 5/02 (2006.01); H01L 21/67 (2006.01); G01R 31/28 (2006.01); G01N 21/01 (2006.01); H01L 21/677 (2006.01); G01R 27/00 (2006.01); G01J 5/08 (2006.01); G01B 11/06 (2006.01); G01B 11/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6732 (2013.01); G01J 5/0007 (2013.01); G01J 5/025 (2013.01); G01N 21/01 (2013.01); G01N 21/211 (2013.01); G01N 21/55 (2013.01); G01R 27/00 (2013.01); G01R 31/2831 (2013.01); G01R 31/2867 (2013.01); H01L 21/677 (2013.01); H01L 21/67253 (2013.01); H01L 21/67353 (2013.01); H01L 21/67386 (2013.01); H01L 22/10 (2013.01); H01L 22/12 (2013.01); G01B 11/06 (2013.01); G01B 11/30 (2013.01); G01J 5/0825 (2013.01); G01J 5/0896 (2013.01); G01N 2021/0112 (2013.01); G01N 2201/0221 (2013.01); G01N 2201/0683 (2013.01); G01N 2201/06113 (2013.01); G01N 2201/12 (2013.01); G05B 2219/37224 (2013.01); H01L 21/67745 (2013.01);
Abstract

Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.


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