The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Apr. 17, 2018
Applicant:

Samsung Electro-mechanics, Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Taek Jung Lee, Suwon-si, KR;

Jin Kyung Joo, Suwon-si, KR;

Seung Woo Song, Suwon-si, KR;

Hyo Youn Lee, Suwon-si, KR;

Sung Kwon An, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/224 (2006.01); H01G 4/236 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 4/012 (2013.01); H01G 4/224 (2013.01); H01G 4/236 (2013.01); H01G 4/30 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01);
Abstract

A capacitor component includes a body including an active layer and an upper cover and a lower cover disposed on an upper part and a lower part of the active layer, respectively; first internal electrodes and second internal electrodes disposed inside the active layer; a first active via and a second active via extending in a thickness direction of the active layer to be connected to the first and second internal electrodes, respectively; first and second cover vias extending in a thickness direction of the lower cover to be electrically connected to the first and second active vias and disposed at an interval narrower than an interval between the first and second active vias; and first and second lower electrodes disposed in a lower surface of the lower cover to be connected to the first and second cover vias, respectively.


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