The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Sep. 26, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Shinya Onodera, Tokyo, JP;

Takehisa Tamura, Tokyo, JP;

Atsushi Takeda, Tokyo, JP;

Ken Morita, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/06 (2006.01); H01G 4/005 (2006.01); H05K 1/18 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 2/065 (2013.01); H01G 4/005 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H01G 4/2325 (2013.01);
Abstract

An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.


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