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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10817701 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Feb. 22, 2019

Electronic device including sensor

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Byungseon Hwang, Suwon-si, KR;

Deokhee Lee, Suwon-si, KR;

Sunggyu Lee, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Jefferson IP Law, LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Adam S Bowen

Int. Cl.
CPC ...
G06K 9/00 (2006.01); B32B 27/16 (2006.01); G06F 1/16 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); B32B 27/16 (2013.01); G06F 1/1626 (2013.01); G06K 9/0004 (2013.01); H01L 23/29 (2013.01); H01L 24/29 (2013.01); H04M 1/026 (2013.01); H01L 2224/2919 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a fingerprint sensor including a sensor having a surface including epoxy molding compound (EMC) resin, a first layer disposed on the surface of the sensor or above the surface of the sensor, and a second layer disposed on the first layer or above the first layer. The first layer includes a first ultraviolet (UV) hardening material having first hardness. The second layer includes a second UV hardening material having second hardness greater than the first hardness and a surface of the second layer has surface roughness less than a specified value.

Find Patent Forward Citations

Hwang, Byungseon. (2020). Electronic device including sensor (U.S. Patent No. 10817701). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10817701

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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