The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Oct. 25, 2018
Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventors:

Il-Soo Kim, Paju-si, KR;

Dong-Hwi Kim, Paju-si, KR;

Ki-Seong Kim, Paju-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); H01L 25/13 (2006.01); H05K 1/18 (2006.01); H01L 33/58 (2010.01); H01L 25/075 (2006.01); H05K 1/02 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
G02F 1/133606 (2013.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H01L 25/13 (2013.01); H01L 33/58 (2013.01); H05K 1/181 (2013.01); G02F 1/133605 (2013.01); G02F 2001/133607 (2013.01); G02F 2001/133614 (2013.01); H01L 33/54 (2013.01); H05K 1/0274 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/2054 (2013.01);
Abstract

A backlight unit includes: a plurality of light emitting diode (LED) packages on a top surface of a circuit board; an encapsulation layer located on the circuit board and covering the plurality of LED packages; and an integrated pattern sheet on the encapsulation layer, the integrated pattern sheet including: a base layer; a plurality of lens patterns at a top surface of the base layer and respectively corresponding to the plurality of LED packages; and hollow cavity particles at a bottom surface of the base layer and at a region between the plurality of LED packages.


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