The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Jul. 26, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ki-Jae Song, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
An apparatus for testing a signal speed of a semiconductor package may include a plurality of sockets, one or more test boards including at least a first test board, an extension board and a test head. Each of the sockets may be configured to receive the semiconductor package. The first test board may include a plurality of mount regions on which the sockets may be mounted, and test lines extended from the mount regions toward at least one side surface of the first test board. The extension board may be vertically arranged at the side surface of the first test board. The extension board may be electrically connected to the test lines. The test head may be electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board. Thus, it may not be required to change a structure of the socket in accordance with types of the semiconductor packages.