The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Mar. 23, 2017
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Kei Saegusa, Kanagawa, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
A copper alloy sheet material which contains 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1.2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities. The material fulfills the relationships 1.0≤I {200}/I{200}≤5.0 and 5.0 μm≤GS≤60.0 μm, and these have the relationship (Equation 1): 5.0≤{(I {200}/I{200})/GS}×100≤21.0, in which the I {200} represents an X-ray diffraction intensity of a {200} crystal plane, the I{200} represents an X-ray diffraction intensity of a {200} crystal plane of standard pure copper powder, and the GS (μm) represents an average crystal grain size. An electrical conductivity is 43.5% to 55.0% IACS and 0.2% yield strength is 720 to 900 MPa.