The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10815557 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 27, 2020

Filed:

Mar. 23, 2017
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Kei Saegusa, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/08 (2006.01); C22C 9/00 (2006.01); C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01);
Abstract

A copper alloy sheet material which contains 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1.2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities. The material fulfills the relationships 1.0≤I {200}/I{200}≤5.0 and 5.0 μm≤GS≤60.0 μm, and these have the relationship (Equation 1): 5.0≤{(I {200}/I{200})/GS}×100≤21.0, in which the I {200} represents an X-ray diffraction intensity of a {200} crystal plane, the I{200} represents an X-ray diffraction intensity of a {200} crystal plane of standard pure copper powder, and the GS (μm) represents an average crystal grain size. An electrical conductivity is 43.5% to 55.0% IACS and 0.2% yield strength is 720 to 900 MPa.


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Saegusa, Kei. (2020). Copper alloy sheet material and method for producing copper alloy sheet material (U.S. Patent No. 10815557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10815557

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