The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10815401 B1

Date of Patent:

Oct. 27, 2020

Filed:

Sep. 16, 2016

Block copolymer composition and hot melt adhesive composition

Applicant:

Zeon Corporation, Chiyoda-ku, Tokyo, JP;

Inventors:

Atsushi Nozawa, Tokyo, JP;

Sadaharu Hashimoto, Tokyo, JP;

Assignee:

ZEON CORPORATION, Chiyoda-ku, Tokyo, JP;

Attorney:

Kenja IP Law PC

Primary Examiner:

Mark S Kaucher

Int. Cl.

CPC ...

C09J 153/02 (2006.01); C08L 53/02 (2006.01); C08L 101/12 (2006.01); C08F 297/04 (2006.01);

U.S. Cl.

CPC ...

C09J 153/02 (2013.01); C08F 297/046 (2013.01); C08L 53/02 (2013.01); C08L 101/12 (2013.01); C08L 2205/02 (2013.01);

Abstract

A main object of the present disclosure is to provide a block copolymer composition that allows a hot melt adhesive composition having excellent hot melt properties and heat resistance stability to be obtained. The object is achieved by providing a block copolymer composition comprising a block copolymer A including an Ar-Ddiblock as a branched chain, the block copolymer A represented by the following general formula (I), characterized in that: a molecular weight distribution (Mw/Mn) of the block copolymer A is 1.20 or less; a content of the block copolymer A in the block copolymer composition is 10% by mass or more; a content of a block copolymer B corresponding to an Ar-Ddiblock represented by the following general formula (II), in the block copolymer composition is 60% by mass or less, and a molecular weight distribution (Mw/Mn) of the block copolymer B is 1.15 or less; a content of an aromatic monovinyl monomer unit in the block copolymer composition is in a range of 12% by mass to 30% by mass; a weight average molecular weight (Mw) of the entire block copolymer composition is in a range of 300000 to 800000; and a melt index (G condition) of the entire block copolymer composition is in a range of 2 g/10 min to 20 g/10 min.

Find Patent Forward Citations

Nozawa, Atsushi. (2020). Block copolymer composition and hot melt adhesive composition (U.S. Patent No. 10815401). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10815401

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