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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10815371 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Mar. 28, 2017

Polyacetal resin composition and molded product thereof

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Masato Hirooka, Mie, JP;

Daisuke Sunaga, Mie, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Jeffrey C Mullis

Int. Cl.
CPC ...
C08L 59/02 (2006.01); C08L 27/18 (2006.01); C08L 23/00 (2006.01); C08L 59/00 (2006.01); C08L 23/08 (2006.01); C08L 5/00 (2006.01); B29C 33/62 (2006.01); C08K 5/01 (2006.01); C08K 5/12 (2006.01); C08K 5/13 (2006.01); B29K 59/00 (2006.01);
U.S. Cl.
CPC ...
C08L 59/02 (2013.01); B29C 33/62 (2013.01); C08K 5/01 (2013.01); C08K 5/12 (2013.01); C08K 5/13 (2013.01); C08L 5/00 (2013.01); C08L 23/00 (2013.01); C08L 23/08 (2013.01); C08L 27/18 (2013.01); C08L 59/00 (2013.01); B29K 2059/00 (2013.01); B29K 2995/0067 (2013.01); B29K 2995/0069 (2013.01);
Abstract

A polyacetal resin composition and a molded product thereof are provided which are excellent in thermal stability, little elution of components of the resin composition upon brought into contact with fuel, and good releasability from the mold at the time of molding, and which is excellent in the points of thermal stability, fuel oil resistance and mold releasability. Provided is a polyacetal resin composition which includes (A) a polyacetal resin and (B) a mold release agent, (B) the mold release agent is a polyolefin-based wax and/or a polytetrafluoroethylene-based wax, and a content of (B) the mold release agent in the polyacetal resin composition is 0.01 part by mass or more and 1.0 part by mass or less based on 100 parts by mass of (A) the polyacetal resin.

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