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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10815349 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Jul. 04, 2016

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Katsuya Tomizawa, Tokyo, JP;

Tomoki Hamajima, Tokyo, JP;

Shohei Yamaguchi, Tokyo, JP;

Eisuke Shiga, Tokyo, JP;

Meguru Ito, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Gregory Listvoyb

Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08K 5/3417 (2006.01); C08K 5/3445 (2006.01); C08K 5/3415 (2006.01); C08L 79/08 (2006.01); C09D 179/08 (2006.01); C08L 79/00 (2006.01); C08G 61/02 (2006.01); C08G 73/00 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01); H01L 21/48 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); C08G 61/02 (2013.01); C08G 73/00 (2013.01); C08K 5/3415 (2013.01); C08K 5/3417 (2013.01); C08K 5/3445 (2013.01); C08L 63/00 (2013.01); C08L 79/00 (2013.01); C08L 79/085 (2013.01); C09D 179/085 (2013.01); H01L 23/145 (2013.01); H01L 23/562 (2013.01); H05K 1/0373 (2013.01); C08J 2379/00 (2013.01); C08J 2465/00 (2013.01); H01L 21/4846 (2013.01); H05K 3/022 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/068 (2013.01);
Abstract

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

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Tomizawa, Katsuya. (2020). Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board (U.S. Patent No. 10815349). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10815349

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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