The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jun. 11, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Timothy W. Scales, San Francisco, CA (US);

Whitney D. Mattson, Menlo Park, CA (US);

Benjamin A. Stevenson, Oakland, CA (US);

Linda D. Benavente-Notaro, Sherman Oaks, CA (US);

Nicholas R. Trincia, San Francisco, CA (US);

William H. Chui, Santa Clara, CA (US);

Hao Zhu, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B32B 9/04 (2006.01); F21V 15/01 (2006.01); B32B 1/02 (2006.01); B32B 9/02 (2006.01); B32B 27/10 (2006.01); B32B 27/20 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); B32B 9/06 (2006.01); B32B 29/00 (2006.01); F21V 23/04 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
B32B 9/045 (2013.01); B32B 1/02 (2013.01); B32B 9/025 (2013.01); B32B 9/06 (2013.01); B32B 27/10 (2013.01); B32B 27/20 (2013.01); B32B 29/005 (2013.01); F21V 15/01 (2013.01); F21V 23/0442 (2013.01); H05K 1/0366 (2013.01); H05K 1/185 (2013.01); B32B 2260/021 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2307/208 (2013.01); B32B 2457/00 (2013.01); F21Y 2115/10 (2016.08); H05K 2201/083 (2013.01); H05K 2201/10113 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An item may be formed from layers of material such as leatherboard layers. A leatherboard layer may include fibrous natural material such as leather or paper embedded in polymer. Portions of the leatherboard layer can be locally modified by incorporation of filler material with desired properties. The filler material may include magnetic particles, conductive particles, or other material. By incorporating the filler material in localized portions of the leatherboard layer, integral electrodes or magnets may be formed. The leatherboard layer may also include embedded circuitry. Items such as enclosures and other items may be formed from the leatherboard layer. The leatherboard layer in an item may include locally modified regions such as magnet regions that are configured to form a closure or other structures that interact with each other.


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