The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Aug. 23, 2018
Applicant:

Tungaloy Corporation, Fukushima, JP;

Inventors:

Hirosato Nishizawa, Iwaki, JP;

Kenji Metoki, Iwaki, JP;

Assignee:

TUNGALOY CORPORATION, Fukushima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 27/14 (2006.01); B28B 11/04 (2006.01); B28B 11/24 (2006.01); C23C 14/32 (2006.01); C23C 14/06 (2006.01); C04B 35/5831 (2006.01); C23C 14/02 (2006.01); C23C 30/00 (2006.01); C04B 35/645 (2006.01); C04B 41/00 (2006.01); C04B 41/52 (2006.01); C04B 41/89 (2006.01);
U.S. Cl.
CPC ...
B23B 27/148 (2013.01); B28B 11/04 (2013.01); B28B 11/243 (2013.01); C04B 35/5831 (2013.01); C04B 35/645 (2013.01); C04B 41/00 (2013.01); C04B 41/009 (2013.01); C04B 41/52 (2013.01); C04B 41/89 (2013.01); C23C 14/022 (2013.01); C23C 14/0641 (2013.01); C23C 14/0647 (2013.01); C23C 14/0664 (2013.01); C23C 14/325 (2013.01); C23C 30/005 (2013.01); B23B 2226/125 (2013.01); B23B 2228/105 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3813 (2013.01); C04B 2235/3843 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/3856 (2013.01); C04B 2235/3873 (2013.01); C04B 2235/3886 (2013.01); C04B 2235/402 (2013.01); C04B 2235/404 (2013.01); C04B 2235/405 (2013.01); C04B 2235/786 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01);
Abstract

A coated cutting tool, comprising: a substrate made of a cubic boron nitride-containing sintered body; and a coating layer formed on the substrate, wherein the cubic boron nitride-containing sintered body includes 65 volume % or more and 85 volume % or less of cubic boron nitride, and 15 volume % or more and 35 volume % or less of a binder phase; the cubic boron nitride is in a form of particles, the particles having an average particle size from 1.5 μm or more to 4.0 μm or less; the coating layer includes a lower layer, and an upper layer formed on the lower layer; the lower layer contains particles each having a composition represented by (TiAl)N; the lower layer has an average thickness from 0.1 μm or more to 1.0 μm or less; the particles forming the lower layer have an average particle size from 0.01 μm or more to 0.05 μm or less; the upper layer contains particles each having a composition represented by (TiAl)(CN); and the upper layer has an average thickness from 1.0 μm or more to 5.0 μm or less.


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