Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods

Abstract

Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip () having a main surface comprising a plurality of ultrasound transducer elements () and a plurality of first contacts () for connecting to said ultrasound transducer elements; a contact chip () having a further main surface comprising a plurality of second contacts (); an backing member () comprising ultrasound absorbing and/or scattering bodies (), said backing member comprising a first surface () on which the transducer chip is mounted and a second surface () on which the contact chip is mounted; and a flexible interconnect () extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.