The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jan. 09, 2018
Applicant:

Cda Research Group, Inc., Pittsburgh, PA (US);

Inventors:

Dominic C. Abbott, Pittsburgh, PA (US);

ChunLim Abbott, Pittsburgh, PA (US);

Assignee:

CDA RESEARCH GROUP, INC., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 33/34 (2006.01); A61K 8/19 (2006.01); A61Q 11/00 (2006.01); A61Q 17/00 (2006.01); A61K 9/00 (2006.01); A61K 9/02 (2006.01); A61K 9/06 (2006.01); A61K 9/12 (2006.01); A01M 31/00 (2006.01); A61K 9/08 (2006.01); A61K 9/10 (2006.01); A61K 9/70 (2006.01);
U.S. Cl.
CPC ...
A61K 33/34 (2013.01); A01M 31/00 (2013.01); A61K 8/19 (2013.01); A61K 9/006 (2013.01); A61K 9/0014 (2013.01); A61K 9/0031 (2013.01); A61K 9/0034 (2013.01); A61K 9/0036 (2013.01); A61K 9/0043 (2013.01); A61K 9/0046 (2013.01); A61K 9/02 (2013.01); A61K 9/06 (2013.01); A61K 9/08 (2013.01); A61K 9/10 (2013.01); A61K 9/12 (2013.01); A61K 9/122 (2013.01); A61K 9/7084 (2013.01); A61Q 11/00 (2013.01); A61Q 17/005 (2013.01);
Abstract

Provided herein are topical formulations containing copper ions and methods of treating inflammatory, microbial, and arthritic conditions in various areas of the body using such formulations. Methods of treating osteoarthritis using topical copper ion treatments are provided. Methods of treating and preventing microbial infections using copper ion treatments are further provided, including methods of preventing biofilm. A topical treatment in its basic form comprises a biocompatible copper ion solution or suspension obtained by leaching of the copper ions from copper metal. The copper ion solution or suspension is combined with various carriers to form the copper ion treatment including creams, gels, lotions, foams, pastes, tampons, solutions, suppositories, body wipes, wound dressings, skin patches, and suture material. Methods of making the copper ion solution or suspension from solid copper metal in a biocompatible solution are also provided.


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