The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 09, 2017
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Mohammed Benwadih, Champagny sur Marne, FR;

Abdelkader Aliane, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B05D 1/02 (2006.01); H05K 3/12 (2006.01); C09D 11/52 (2014.01); C09D 11/037 (2014.01); B81B 7/00 (2006.01); C09D 11/322 (2014.01); C09D 11/36 (2014.01); H01Q 7/00 (2006.01); C09D 11/033 (2014.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H01Q 1/38 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); B05D 1/02 (2013.01); B81B 7/0006 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/36 (2013.01); C09D 11/52 (2013.01); H01Q 7/00 (2013.01); H05K 3/0014 (2013.01); B81B 2207/07 (2013.01); H01Q 1/38 (2013.01); H05K 1/0284 (2013.01); H05K 1/092 (2013.01); H05K 1/097 (2013.01); H05K 1/165 (2013.01); H05K 2201/032 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/013 (2013.01);
Abstract

A device including an electrically conducting track arranged on a support includes a step of supply of the support, and a step of formation of the electrically conducting track on the support including a step of supply of a solution intended to be deposited on the support, a step of deposition of the solution by printing on the support. The step of supply of the solution is such that the solution supplied includes a mixture of a solvent, of a set of metal particles and of a metallic material having a melting point below that of the metal particles of the set of metal particles, and the method includes a step of melting of the metallic material which results in the formation of a solder of metallic material between metal particles of the set of metal particles.


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