The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Apr. 25, 2018
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Shusaku Shibata, Osaka, JP;
Hayato Takakura, Osaka, JP;
Yoshihiro Kawamura, Osaka, JP;
Shuichi Wakaki, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/036 (2013.01); H05K 1/181 (2013.01); H05K 3/287 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10/% RH or less.