The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 19, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shuichi Kezuka, Nagaokakyo, JP;

Kuniaki Yosui, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/145 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H01L 21/486 (2013.01); H01L 21/4871 (2013.01); H01L 23/145 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H05K 1/0204 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/4069 (2013.01); H05K 3/4644 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/18 (2013.01); H05K 1/185 (2013.01); H05K 3/4632 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/049 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10969 (2013.01);
Abstract

A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.


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