The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jul. 11, 2018
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Ankush Mohan, Thousand Oaks, CA (US);

Soack Yoon, Torrance, CA (US);

Dan Denninghoff, Thousand Oaks, CA (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); H01P 3/08 (2006.01); H01P 5/19 (2006.01); H01Q 13/08 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H01P 3/08 (2013.01); H01P 5/19 (2013.01); H01Q 13/085 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03F 2200/255 (2013.01); H03F 2200/315 (2013.01); H03F 2200/423 (2013.01);
Abstract

Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed. An SSPA includes a waveguide channel that is configured to propagate an input signal, such as an electromagnetic signal, from an input port to a solid state amplifier for amplification. The waveguide channel is further configured to propagate an amplified signal from the solid state amplifier to an output port. Waveguide transitions to and from the solid state amplifier are bandwidth matched to the waveguide channel. Additionally, the waveguide transitions may be thermally coupled to the waveguide channel. The waveguide transitions may include antenna structures that have a signal conductor and a ground conductor. In this manner, the SSPA may have improved broadband coupling as well as improved thermal dissipation for heat generated by the solid state amplifier.


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