The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Mar. 13, 2018
Applicant:

Covidien Lp, Mansfield, MA (US);

Inventors:

Christopher Penna, Guilford, CT (US);

Anthony Sgroi, Jr., Wallingford, CT (US);

Charlie Kollar, West Hartford, CT (US);

David Valentine, East Hampton, CT (US);

Justin Williams, Southbury, CT (US);

Patrick Mozdzierz, Glastonbury, CT (US);

Stephen Paul, East Hartford, CT (US);

Ramiro Cabrera, Cheshire, CT (US);

Steven Joyce, Wallingford, CT (US);

Joseph Guerrera, Watertown, CT (US);

Assignee:

Covidien LP, Mansfield, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 17/115 (2006.01); H01R 13/52 (2006.01); H01R 12/71 (2011.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); A61B 90/90 (2016.01); A61B 90/98 (2016.01); A61B 17/00 (2006.01); A61B 90/00 (2016.01); H01R 13/627 (2006.01); H01R 33/06 (2006.01); H01R 13/66 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5224 (2013.01); A61B 17/1155 (2013.01); A61B 90/90 (2016.02); A61B 90/98 (2016.02); H01L 23/49861 (2013.01); H01L 24/08 (2013.01); H01R 12/712 (2013.01); H01R 13/5219 (2013.01); A61B 2017/00017 (2013.01); A61B 2017/0023 (2013.01); A61B 2017/0046 (2013.01); A61B 2017/00398 (2013.01); A61B 2017/00473 (2013.01); A61B 2017/00477 (2013.01); A61B 2090/0803 (2016.02); A61B 2090/0814 (2016.02); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/08245 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/17106 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/14511 (2013.01); H01R 13/6278 (2013.01); H01R 13/6691 (2013.01); H01R 33/06 (2013.01); H01R 2201/12 (2013.01);
Abstract

An improved chip assembly for use in a stapling device includes a housing assembly receivable within a reload assembly. The housing assembly includes a base member defining a cavity and an identification assembly received within the cavity. The chip assembly further includes a plug assembly configured to selectively engage the base member. The plug assembly includes a housing, a wire extending from the housing, a seal member disposed within and extending from a distal end of the housing, and first and second contact members extending through the seal member and from the housing. The seal member is configured to be frictionally received within the base member to secure the plug assembly to the housing assembly in a fluid tight manner.


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