The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Feb. 06, 2019
Applicant:

Metrospec Technology, L.l.c., Mendota Heights, MN (US);

Inventor:

Henry V. Holec, Mendota Heights, MN (US);

Assignee:

Metrospec Technology, L.L.C., Mendota Heights, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/73 (2011.01); H05K 1/02 (2006.01); H01R 12/72 (2011.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
H01R 12/73 (2013.01); H01R 12/721 (2013.01); H01R 13/52 (2013.01); H05K 1/0277 (2013.01);
Abstract

Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.


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