The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Jun. 15, 2016
Applicant:
Osram Oled Gmbh, Regensburg, DE;
Inventors:
Andreas Loeffler, Neutraubling, DE;
Thomas Hager, Massing, DE;
Christoph Walter, Regensburg, DE;
Alfred Lell, Maxhuette-Haidhof, DE;
Assignee:
OSRAM OLED GMBH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 25/16 (2006.01); H01L 31/02 (2006.01); H01L 31/024 (2014.01); H01L 31/167 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01L 31/0232 (2014.01); H01L 33/58 (2010.01); H01S 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 25/165 (2013.01); H01L 25/167 (2013.01); H01L 31/024 (2013.01); H01L 31/02005 (2013.01); H01L 31/167 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01S 5/02248 (2013.01); H01S 5/02272 (2013.01); H01S 5/02469 (2013.01); H01S 5/02476 (2013.01); H01L 31/02327 (2013.01); H01L 33/58 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01S 5/0071 (2013.01);
Abstract
An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.