The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Jun. 14, 2019
Nichia Corporation, Anan-shi, Tokushima, JP;
Kazuma Kozuru, Tokushima, JP;
Ryota Okuno, Tokushima, JP;
NICHIA CORPORATION, Anan-shi, JP;
Abstract
A method of manufacturing a semiconductor device includes: a solder ball forming step comprising forming a plurality of solder balls at intervals on (i) a surface of a package surrounding a recess, or (ii) a surface of the light-transmissive member facing the surface of the package surrounding the recess (i) the surface of a light-transmissive member, or (ii) the surface of the package, into contact with an upper surface of the solder balls, which are softened, such that an air passage communicating with the recess is formed between the solder balls; and a bonding step comprising reducing a pressure in the recess via the air passage, and thereafter, in a state in which a gas for sealing is injected, heating and pressing the light-transmissive member and the package, to melt the solder balls and bond the light-transmissive member and the package.