The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Aug. 25, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takao Kachi, Tokyo, JP;

Yasuhiro Yoshiura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 21/283 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66136 (2013.01); H01L 21/02532 (2013.01); H01L 21/283 (2013.01); H01L 21/30604 (2013.01); H01L 21/32133 (2013.01); H01L 29/0634 (2013.01);
Abstract

It is an object of the present invention to easily perform an electric characteristic test for ensuring quality of a semiconductor device on an electrode pattern defect or deficiency. A method of manufacturing a semiconductor device according to the present invention performs, a first etching having a higher selected ratio with respect to a semiconductor material of a first semiconductor layer than a material of a first electrode film over the first electrode film, and removes a region in the first semiconductor layer below a pattern defective part or a deficiency part of the first electrode film at least partially to form an electrode film in the pattern defective part or the deficiency part of the first electrode film.


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