The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Mar. 18, 2019
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Thomas Scott Morris, Lewisville, NC (US);

Stephen Craig Parker, Burlington, NC (US);

Jerry Holt, Hillsborough, NC (US);

John Davisson, Kernersville, NC (US);

Rommel Quintero Nevarez, High Point, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/76873 (2013.01); H01L 21/76874 (2013.01); H01L 23/3128 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01);
Abstract

The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.


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