The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Aug. 06, 2019
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Ki Jun Sung, Cheongju-si, KR;
Kyoung Tae Eun, Seoul, KR;
Assignee:
Sk hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/14 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 23/145 (2013.01); H01L 23/296 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5381 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/24 (2013.01); H01L 25/0652 (2013.01); H01L 25/071 (2013.01); H01L 25/112 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24155 (2013.01);
Abstract
A stack package includes a first sub-package, a second sub-package stacked on the first sub-package. The first sub-package is configured to include first and second semiconductor dies, a first flexible bridge die disposed between the first and second semiconductor dies.
Sung, Ki. (2020). Stack packages relating to bridge die (U.S. Patent No. 10811359). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10811359
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile