The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
May. 13, 2019
Renesas Electronics Corporation, Tokyo, JP;
Kuniharu Muto, Tokyo, JP;
Hideyuki Nishikawa, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
Assembly of the semiconductor device includes the following steps: (a) mounting a semiconductor chip on the bottom electrode; (b) mounting the top electrodeon the semiconductor chip; (c) forming a sealing bodymade of resin and provided with a convex portionso as to cover the semiconductor chip; and (d) exposing the electrode surfaceof the top electrodeon the top surface of the sealing bodyand exposing the electrode surfaceof the bottom electrodeon the back surface of the sealing body. In the step (d), at least one of the electrode surfaceand the electrode surfaceis exposed from the sealing bodyby irradiating at least one of the front surface and the back surface of the sealing bodywith the laser