The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Mar. 28, 2018
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Tsutomu Ogihara, Joetsu, JP;
Osamu Watanabe, Joetsu, JP;
Takeshi Nagata, Joetsu, JP;
Naoki Kobayashi, Joetsu, JP;
Daisuke Kori, Joetsu, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C11D 11/00 (2006.01); B08B 3/08 (2006.01); C11D 7/50 (2006.01); C11D 7/28 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02071 (2013.01); B08B 3/08 (2013.01); B81C 1/00857 (2013.01); B81C 1/00952 (2013.01); C11D 7/28 (2013.01); C11D 7/5018 (2013.01); C11D 7/5022 (2013.01); C11D 11/0047 (2013.01); H01L 21/02057 (2013.01);
Abstract
A cleaning and drying method of a semiconductor substrate capable of suppressing collapse or breakdown of a pattern which occur at the time of drying a cleaning solution after cleaning the substrate and decomposition of a resin at a bottom of the pattern, and capable of removing the cleaning solution with good efficiency without using a specific device.