The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Sep. 28, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Paul A. Martinez, Morgan Hill, CA (US);

Won Seop Choi, Pleasanton, CA (US);

Gang Ning, Santa Clara, CA (US);

Chirag V. Shah, Milpitas, CA (US);

Martin Schauer, Fremont, CA (US);

Curtis C. Mead, Sacramento, CA (US);

Ming Yuan Tsai, San Jose, CA (US);

Albert Wang, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/005 (2013.01); H01G 4/12 (2013.01); H01G 4/228 (2013.01);
Abstract

Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.


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