The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jan. 09, 2018
Applicant:

Shenzhen Sunlord Electronics Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Shengcheng Xia, Guangdong, CN;

Youyun Li, Guangdong, CN;

Assignee:

Shenzhen Sunlord Electronics Co., Ltd., Shenzhen, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/076 (2016.01); H01B 13/06 (2006.01); H01F 41/064 (2016.01); H01F 41/02 (2006.01); C03C 14/00 (2006.01); H01F 41/12 (2006.01); H01B 3/08 (2006.01); H01F 27/255 (2006.01); B05D 3/02 (2006.01); B05D 3/12 (2006.01); C03C 8/16 (2006.01); H01B 7/02 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/06 (2016.01);
U.S. Cl.
CPC ...
H01F 41/076 (2016.01); B05D 3/0254 (2013.01); B05D 3/12 (2013.01); C03C 8/16 (2013.01); C03C 14/008 (2013.01); H01B 3/08 (2013.01); H01B 7/02 (2013.01); H01B 13/06 (2013.01); H01B 13/065 (2013.01); H01F 27/255 (2013.01); H01F 27/2823 (2013.01); H01F 27/292 (2013.01); H01F 41/0206 (2013.01); H01F 41/0246 (2013.01); H01F 41/06 (2013.01); H01F 41/064 (2016.01); H01F 41/127 (2013.01); C03C 2207/02 (2013.01); C03C 2214/12 (2013.01);
Abstract

A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80° C. to 150° C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 μm. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.


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