The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Feb. 26, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Scott Andrew Parish, Milton Keynes, GB;

Christopher Featherstone, Milton Keynes, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/30 (2006.01); H01F 27/26 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/266 (2013.01); H01F 27/2804 (2013.01); H01F 27/2895 (2013.01); H01F 41/046 (2013.01); H01F 2027/2819 (2013.01);
Abstract

In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.


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