The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Apr. 08, 2015
Applicant:

William Marsh Rice University, Houston, TX (US);

Inventors:

James M. Tour, Bellaire, TX (US);

Yang Yang, Wanliuyuan community, CN;

Gedeng Ruan, Houston, TX (US);

Assignee:

WILLIAM MARSH RICE UNIVERSITY, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 5/14 (2006.01); H01B 1/02 (2006.01); H01B 3/42 (2006.01); C23C 28/02 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); C23C 14/20 (2006.01); C25D 7/00 (2006.01); C25D 3/12 (2006.01); C25D 5/48 (2006.01); C25D 11/34 (2006.01); C25D 11/04 (2006.01); C25D 11/32 (2006.01); C25D 11/30 (2006.01); H01G 11/30 (2013.01); H01G 11/26 (2013.01); H01G 11/86 (2013.01); H01G 9/00 (2006.01); H01G 9/025 (2006.01); H01G 9/042 (2006.01); H01G 11/56 (2013.01); H01M 4/58 (2010.01); H01M 4/66 (2006.01); H01M 10/0525 (2010.01); H01M 10/056 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); C23C 14/205 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); C25D 3/12 (2013.01); C25D 5/48 (2013.01); C25D 7/00 (2013.01); C25D 11/34 (2013.01); H01B 1/02 (2013.01); H01G 9/0036 (2013.01); H01G 9/025 (2013.01); H01G 9/042 (2013.01); H01G 11/26 (2013.01); H01G 11/30 (2013.01); H01G 11/86 (2013.01); H01M 4/582 (2013.01); H01M 4/663 (2013.01); H01M 10/056 (2013.01); H01M 10/0525 (2013.01); C25D 11/04 (2013.01); C25D 11/30 (2013.01); C25D 11/32 (2013.01); H01G 11/56 (2013.01); H01M 2004/021 (2013.01); H01M 2300/0091 (2013.01); Y02E 60/13 (2013.01);
Abstract

Embodiments of the present disclosure pertain to methods of making conductive films by associating an inorganic composition with an insulating substrate, and forming a porous inorganic layer from the inorganic composition on the insulating substrate. The inorganic layer may include a nanoporous metal layer, such as nickel fluoride. The methods of the present disclosure may also include a step of incorporating the conductive films into an electronic device. The methods of the present disclosure may also include a step of associating the conductive films with a solid electrolyte prior to its incorporation into an electronic device. The methods of the present disclosure may also include a step of separating the inorganic layer from the conductive film to form a freestanding inorganic layer. Further embodiments of the present disclosure pertain to the conductive films and freestanding inorganic layers.


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