The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Sep. 12, 2018
Applicant:

Alps Alpine Co., Ltd., Tokyo, JP;

Inventors:

Hideto Sasagawa, Niigata-ken, JP;

Takashi Asakawa, Niigata-ken, JP;

Takefumi Osaka, Niigata-ken, JP;

Yutaka Takashima, Niigata-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/041 (2006.01); B32B 7/02 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/365 (2013.01); G06F 3/041 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2307/414 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04107 (2013.01); G06F 2203/04111 (2013.01);
Abstract

A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.


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