The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10809747 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 20, 2020

Filed:

Dec. 11, 2017
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventor:

Michael J. Andres, Roscoe, IL (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G05D 23/02 (2006.01); H01M 10/6551 (2014.01); H01M 10/655 (2014.01); H01M 10/613 (2014.01); B64D 37/34 (2006.01); H01M 10/625 (2014.01); H01M 10/63 (2014.01); H01M 10/66 (2014.01); F28F 13/00 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
G05D 23/02 (2013.01); B64D 37/34 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/63 (2015.04); H01M 10/655 (2015.04); H01M 10/6551 (2015.04); H01M 10/66 (2015.04); F28D 2021/008 (2013.01); F28D 2021/0021 (2013.01); F28D 2021/0029 (2013.01); F28D 2021/0043 (2013.01); F28F 2013/005 (2013.01); F28F 2013/006 (2013.01); F28F 2013/008 (2013.01);
Abstract

A method for controlling thermal conductivity between two thermal masses includes thermally contacting a first conduction body with a heat source, thermally contacting a second conduction body with a heat sink, and thermally contacting the second conduction body with the first conduction body by moving the first conduction body between a first position and a second position with a thermal expansion component. The thermal expansion component moves the first conduction body between the first position and the second position at a predetermined temperature and heat is conducted from the heat source to the heat sink through the first and second conduction bodies.


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