The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 08, 2018
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Lorrie Sivich, Federal Way, WA (US);

Robert W. Grube, Edmonds, WA (US);

Joseph Doyle, Mount Pleasant, SC (US);

Farshad Forouhar, Lake Forest Park, WA (US);

Jerry D. Zayic, Cle Elum, WA (US);

Gregg W. Podnar, Lakewood, OH (US);

Carrie Rule, Normandy Park, WA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/30 (2006.01); G05B 19/401 (2006.01); B25J 9/16 (2006.01); G01B 11/00 (2006.01);
U.S. Cl.
CPC ...
G05B 19/401 (2013.01); B25J 9/1694 (2013.01); G01B 11/002 (2013.01); G05B 2219/31293 (2013.01);
Abstract

A method includes receiving topic names from a metrology interface device, where the topic names correspond to data generated by metrology devices associated with a manufacturing operation. The method also includes accessing a data stream from the metrology interface device. The data stream includes converted metrology data (in a common format) from the metrology devices and corresponding topic names. The method further includes extracting first converted metrology data from the data stream based on a first topic name of the topic names. The first converted metrology data is generated by converting first metrology data from a first metrology device of the metrology devices to the first converted metrology data having the common format. The method also includes comparing the first converted metrology data to a specification, detecting a condition based on the comparison, and sending a command to a manufacturing device based on the condition.


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