The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Dec. 19, 2018
Applicant:

Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Jean Charbonnier, Grenoble, FR;

Jean-Louis Pornin, Crolles, FR;

Olivier Castany, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2022 (2013.01); B81B 7/0032 (2013.01); B81B 7/02 (2013.01); B81C 1/0023 (2013.01); B81C 1/00833 (2013.01); G02B 6/423 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01); B81B 2203/0315 (2013.01);
Abstract

A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover () to the front face, the bonding being undertaken such that the cover () forms a closed cavity () with the region, advantageously hermetically sealed; Formation of an encapsulation coating (), of thickness E, covering the front face and the cover (); A thinning step for the encapsulation coating (), the thinning step including removal of a removal thickness E, less than the thickness E, of the encapsulation coating (), the removal thickness Ebeing adjusted such that an opening is formed in the cover ().


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