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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10809293 B1

PDFFull Text
Date of Patent:
Oct. 20, 2020

Filed:

Oct. 24, 2017

Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus

Applicant:

Mitsui Chemicals Tohcello, Inc., Chiyoda-ku, Tokyo, JP;

Inventor:

Eiji Hayashishita, Nagoya, JP;

Assignee:

MITSUI CHEMICALS TOCHELLO, INC., Tokyo, JP;

Attorney:

Buchanan, Ingersoll & Rooney PC

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
G01R 31/26 (2020.01); C09J 7/25 (2018.01); C09J 7/38 (2018.01); G01R 1/04 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); C09J 7/24 (2018.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); C09J 7/241 (2018.01); C09J 7/25 (2018.01); C09J 7/255 (2018.01); C09J 7/38 (2018.01); C09J 7/381 (2018.01); C09J 7/385 (2018.01); G01R 1/0408 (2013.01); G01R 31/26 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); C09J 2203/326 (2013.01); C09J 2423/00 (2013.01); C09J 2423/006 (2013.01); C09J 2425/00 (2013.01); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01); C09J 2475/00 (2013.01); C09J 2477/006 (2013.01); C09J 2479/086 (2013.01); C09J 2483/00 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and at least one electronic component affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in an electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand with the adhesive film interposed between the electronic component and the electronic component installation region, the electronic component testing apparatus being provided with a probe card at a position facing the sample stand and includes a probe terminal; a step (C) of evaluating the properties of the electronic component while being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a subsequent step (D) of picking up the electronic component from the adhesive film.

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