The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Dec. 13, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Jessica Lynn Abraham, Chandler, AZ (US);

Jimmie Autrey Beacham, West Allis, WI (US);

Scott William Easterbrook, Bainbridge Island, WA (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); G01D 11/10 (2006.01); G01N 29/22 (2006.01); G10K 11/00 (2006.01); G01N 29/24 (2006.01); A61B 8/00 (2006.01); B29K 63/00 (2006.01); B29K 103/06 (2006.01);
U.S. Cl.
CPC ...
G01N 29/24 (2013.01); A61B 8/4483 (2013.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); G01D 11/10 (2013.01); G01N 29/221 (2013.01); G10K 11/002 (2013.01); B29K 2063/00 (2013.01); B29K 2103/06 (2013.01); B29K 2995/0002 (2013.01);
Abstract

A backing component configured to receive and attenuate transmitted acoustic signals from a transducer element in an ultrasound probe is disclosed. The backing component has a unitary structure of a first material and a second material, and a variation in packing density of the first material across at least a portion of a thickness of the backing component. Further, a method of making a backing component for a transducer element in an ultrasound probe is disclosed. The method includes performing an additive manufacturing technique using a first material and a second material to form the backing component that has a unitary structure of the first material and the second material. Performing the additive manufacturing technique involves varying a packing density of the first material across at least a portion of thickness of the backing component.


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