The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Aug. 28, 2017
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Minkyu Oh, Seoul, KR;

Heayoun Sul, Seoul, KR;

Hyoungkeun Lim, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 11/02 (2006.01); F25B 21/02 (2006.01); F25B 39/02 (2006.01); F25B 25/00 (2006.01); F25D 11/04 (2006.01); F25D 17/06 (2006.01);
U.S. Cl.
CPC ...
F25D 11/022 (2013.01); F25B 21/02 (2013.01); F25B 25/00 (2013.01); F25B 39/02 (2013.01); F25D 11/04 (2013.01); F25D 17/06 (2013.01);
Abstract

A refrigerator may have an ultra-low temperature cooling module for cooling an ultra-low temperature compartment that includes a thermoelectric element having a heating surface and a heat absorption surface disposed to oppose the heating surface and a heat conduction unit evaporation part whose one side is in contact with the heating surface of the thermoelectric element and the other side is connected to a refrigerant pipe of an evaporator to transmit heat emitted from the heating surface of the thermoelectric element to the refrigerant. An amount of heat exchange between a central portion of the heating surface having a relatively high temperature and a refrigerant of the heat conduction unit evaporation part may be greater than an amount of heat exchange between a peripheral portion of the heating surface surrounding the central portion and the refrigerant.


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