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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10808330 B1

PDFFull Text
Date of Patent:
Oct. 20, 2020

Filed:

Feb. 13, 2019

Process for metallizing a component

Applicant:

Fraunhofer-gesellschaft Zur Forderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Markus Glatthaar, Horben, DE;

Jonas Bartsch, Freiburg, DE;

Sven Kluska, Frieburg, DE;

Thibaud Hatt, Freiburg, DE;

Andreas Rodofili, Freiburg, DE;

Martin Hermle, Freiburg, DE;

Assignee:

FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V., , DE;

Attorney:

Tarolli, Sundheim, Covell & Tummino LLP

Primary Examiner:

J E Schoenholtz

Int. Cl.
CPC ...
C25D 5/02 (2006.01); H01L 33/36 (2010.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); H05K 3/10 (2006.01); H05K 3/00 (2006.01); C25D 7/12 (2006.01); C25D 5/54 (2006.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 31/0747 (2012.01); H01L 33/42 (2010.01);
U.S. Cl.
CPC ...
C25D 5/022 (2013.01); C25D 5/54 (2013.01); C25D 7/12 (2013.01); H01L 31/02167 (2013.01); H01L 31/022475 (2013.01); H01L 31/1884 (2013.01); H01L 33/36 (2013.01); H01L 33/38 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H05K 3/002 (2013.01); H05K 3/0029 (2013.01); H05K 3/108 (2013.01); H01L 31/0747 (2013.01); H01L 33/42 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/0723 (2013.01);
Abstract

The present invention relates to a process for producing one or more electrical contacts on a component, comprising (a) applying one or more coatings on the component, where at least one of the coatings is a coating of an electrically conductive material, (b) applying a self-passivating metal or semiconductor and/or a dielectric material on the coated component, (c) structuring the passivating coating by laser treatment or etching, (d) contacting the structured coating with an electroplating bath, (e) etching the regions not covered with the galvanically deposited metal.

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