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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10808153 B1

PDFFull Text
Date of Patent:
Oct. 20, 2020

Filed:

Apr. 18, 2017

Curable adhesive compound and reactive adhesive tapes based thereon

Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Thilo Dollase, Hamburg, DE;

Markus Brodbeck, Stuttgart, DE;

Alexander Fischer, Hamburg, DE;

Marco Kupsky, Quickborn, DE;

Matthias Koop, Norderstedt, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:

Norris McLaughlin, P.A.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C09J 133/06 (2006.01); C09J 5/00 (2006.01); C09J 107/00 (2006.01); C09J 121/00 (2006.01); C09J 123/00 (2006.01); C09J 123/04 (2006.01); C09J 123/08 (2006.01); C09J 123/10 (2006.01); C09J 123/18 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); C09J 163/00 (2006.01); C09J 175/04 (2006.01); B32B 27/26 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); C08K 5/00 (2006.01); C08K 5/19 (2006.01); C09J 179/00 (2006.01); C08K 5/17 (2006.01); C08K 5/02 (2006.01); C08L 33/06 (2006.01); C08K 5/45 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08K 5/0025 (2013.01); C08K 5/02 (2013.01); C08K 5/17 (2013.01); C08K 5/19 (2013.01); C08K 5/45 (2013.01); C08L 33/068 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 179/00 (2013.01);
Abstract

The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

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