The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Nov. 27, 2015
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Kentaro Hoshi, Tokyo-to, JP;

Kazuki Tsukiyama, Tokyo-to, JP;

Masafumi Tanaka, Tokyo-to, JP;

Masaaki Nishi, Wako, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 133/04 (2006.01); C09J 11/06 (2006.01); C09J 109/00 (2006.01); C09J 7/20 (2018.01); C09J 7/40 (2018.01); C08G 59/50 (2006.01); C08F 279/02 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08F 279/02 (2013.01); C08G 59/50 (2013.01); C09J 7/20 (2018.01); C09J 7/40 (2018.01); C09J 11/06 (2013.01); C09J 109/00 (2013.01); C09J 133/04 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01);
Abstract

The present invention aims to provide an adhesive composition which enables achievement of highly strong adhesion between a lightweight composite resin and a lightweight metal member, and which can maintain excellent adhesive strength even in cases where the ambient temperature largely changes or the adhesive composition is in contact with water or a snow-melting agent, and an adhesive sheet using it. The above object can be achieved with an adhesive composition containing at least an epoxy resin, an acrylic particle, and a curing agent, wherein the acrylic particle is a core-shell structure containing a butadiene-based rubber, and polymethacrylate or polyacrylate. The adhesive sheet is constituted such that an adhesive layer formed with the adhesive composition is present between a first release film and a second release film.


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