The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Sep. 23, 2014
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Samuel J. Meure, Fishermans Bend, AU;
Mark S. Wilenski, Mercer Island, WA (US);
Michael P. Kozar, Mercer Island, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08L 67/00 (2006.01); C08L 69/00 (2006.01); C08L 75/04 (2006.01); C08L 71/00 (2006.01); C08L 63/00 (2006.01); H01B 1/12 (2006.01); B32B 27/28 (2006.01); C08J 5/00 (2006.01); B32B 5/26 (2006.01); B32B 27/40 (2006.01); B32B 27/30 (2006.01); C08L 77/00 (2006.01); C08L 61/16 (2006.01); C08L 81/06 (2006.01); C08L 81/04 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 33/00 (2006.01); B32B 27/32 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 7/03 (2019.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B32B 5/024 (2013.01); B32B 7/03 (2019.01); B32B 27/12 (2013.01); B32B 27/285 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C08J 5/005 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 33/00 (2013.01); C08L 61/16 (2013.01); C08L 63/00 (2013.01); C08L 67/00 (2013.01); C08L 69/00 (2013.01); C08L 71/00 (2013.01); C08L 75/04 (2013.01); C08L 77/00 (2013.01); C08L 81/04 (2013.01); C08L 81/06 (2013.01); H01B 1/128 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/105 (2013.01); B32B 2264/02 (2013.01); C08J 2300/24 (2013.01);
Abstract
A composition may include the resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The resin may have a resin coefficient of thermal expansion (CTE), a resin cure shrinkage, and/or a resin heat of reaction. The polymer nanoparticles may have a nanoparticle cure shrinkage less than the resin cure shrinkage, a nanoparticle CTE different than the resin CTE, and/or a nanoparticle heat of reaction less than the resin heat of reaction.