The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Jul. 03, 2018
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Yoshihiro Tsutsumi, Annaka, JP;
Shuichi Fujii, Maebashi, JP;
Kenji Hagiwara, Annaka, JP;
Kazuaki Sumita, Annaka, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.