The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 15, 2017
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yousuke Hirota, Ichihara, JP;

Shota Tanii, Kitaadachi-gun, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); C08G 59/62 (2006.01); C08G 8/12 (2006.01); C08L 61/06 (2006.01); C09D 163/00 (2006.01); H01L 23/29 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08J 5/04 (2013.01); C08G 8/12 (2013.01); C08G 59/62 (2013.01); C08J 5/18 (2013.01); C08L 61/06 (2013.01); C09D 163/00 (2013.01); H01L 23/145 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); C08J 2361/10 (2013.01);
Abstract

A phenol novolak resin having an excellent balance between the mold shrinkage of a composition containing the phenol novolak resin during heat curing and the modulus of elasticity at high temperature. A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween, wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13C-NMR measurement is within the range of 0.05 to 0.30, and the area ratio of alkyl phenol (I) based on GPC measurement is within the range of 0.01% to 3.0%, a curable resin composition using the same, and a cured product thereof.


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