The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Sep. 06, 2018
Applicant:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Inventors:

Takahiro Nakashima, Kamisu, JP;

Takeshi Takahashi, Kamisu, JP;

Minoru Onodera, Saijo, JP;

Assignee:

KURARAY CO., LTD., Kurashiki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 37/06 (2006.01); B32B 38/00 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01); B29C 65/02 (2006.01); B32B 37/20 (2006.01); B32B 37/00 (2006.01); B32B 15/20 (2006.01); B32B 37/10 (2006.01); B29C 65/00 (2006.01); B32B 15/09 (2006.01); C08G 63/06 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0036 (2013.01); B29C 65/02 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 37/003 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/203 (2013.01); H05K 3/022 (2013.01); H05K 3/38 (2013.01); H05K 3/381 (2013.01); H05K 3/382 (2013.01); B29C 66/742 (2013.01); B32B 15/09 (2013.01); B32B 37/0053 (2013.01); B32B 2038/0048 (2013.01); B32B 2305/55 (2013.01); B32B 2307/514 (2013.01); B32B 2307/538 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08G 63/065 (2013.01); C08J 5/18 (2013.01); C08J 2367/04 (2013.01); H05K 1/03 (2013.01); H05K 1/0313 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/068 (2013.01);
Abstract

Provided is a method for producing a metal-clad laminate of a thermoplastic liquid crystal polymer film (TLCP film) and a metal sheet(s) bonded to at least one surface of the film using roll-to-roll processing. The metal sheet has a surface with a ten-point average roughness (Rz) of 5.0 μm or less to be bonded to the TLCP film. The method includes preparing the laminate, dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2): heat-treating the dried laminate by subjecting the laminate passed through a heating zone on a temperature condition of not lower than the melting point of the TLCP film successively after the dry treatment.


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