The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10807301 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 20, 2020

Filed:

Jun. 05, 2017
Applicants:

Centre National DE LA Recherche Scientifique, Paris, FR;

Universite Paris-sud, Orsay, FR;

Inventors:

Mehdi Ammi, Massy, FR;

Florian Longnos, Nieul sur Mer, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/112 (2017.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/118 (2017.01); B29C 64/209 (2017.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 64/112 (2017.08); B29C 64/118 (2017.08); B29C 64/209 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); B29L 2031/3493 (2013.01);
Abstract

Method for manufacturing a mechatronic system comprising: a step of manufacturing a mechanical structure (SM) by three-dimensional printing by fused filament deposition of at least one first electrically insulating material (M), and a step of manufacturing at least one electrical component (CE) in contact with at least one element of said mechanical structure and secured therewith; characterized in that said step of manufacturing at least one electrical component is implemented by three-dimensional printing by fused filament deposition of at least one second material (M), conductive or resistive, directly in contact with said element of the mechanical structure. Apparatus for implementing such a method. Mechatronic system that can be manufactured by such a method.


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