The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Feb. 12, 2016
Applicant:

Toshiba Kikai Kabushiki Kaisha, Tokyo-to, JP;

Inventors:

Hideaki Tobita, Numazu, JP;

Keisuke Mori, Numazu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/66 (2006.01); B29C 45/76 (2006.01); B22D 17/26 (2006.01);
U.S. Cl.
CPC ...
B29C 45/66 (2013.01); B22D 17/26 (2013.01); B22D 17/263 (2013.01); B29C 45/76 (2013.01); B29C 45/7653 (2013.01); B29C 45/661 (2013.01); B29C 2945/76505 (2013.01); B29C 2945/76598 (2013.01); B29C 2945/76602 (2013.01); B29C 2945/76709 (2013.01);
Abstract

A mold clamping apparatus according to the present invention includes: a fixed platen to which one mold of a pair of molds is to be mounted; a movable platen which is disposed opposite the fixed platen and to which the other mold is to be mounted; a pressure-receiving platen connected to the fixed platen via tie bars; a mold opening/closing mechanism including a toggle link mechanism for opening/closing and clamping the molds by moving the movable platen back and forth; a drive mechanism including a servo motor for driving the mold opening/closing mechanism; and a control device for controlling the servo motor, wherein the control device includes an acceleration/deceleration adjustment section capable of adjusting an acceleration time, a deceleration time and a target speed of the servo motor during a mold clamping operation.


Find Patent Forward Citations

Tobita, Hideaki. (2020). Mold clamping apparatrus, molding apparatus and molding method (U.S. Patent No. 10807288). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10807288

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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