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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10806026 B1

PDFFull Text
Date of Patent:
Oct. 13, 2020

Filed:

Sep. 09, 2019

Modified pcb vias to prevent burn events

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Matthew S. Doyle, Chatfield, MN (US);

Joseph Kuczynski, North Port, FL (US);

Jeffrey N. Judd, Oronoco, MN (US);

Scott D. Strand, Rochester, MN (US);

Timothy J. Tofil, Rochester, MN (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 21/50 (2006.01); H01L 21/60 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0293 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/4038 (2013.01); H05K 2201/10181 (2013.01); H05K 2203/081 (2013.01);
Abstract

A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

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